Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022032542
Kind Code:
A
Abstract:
To provide a semiconductor device capable of suppressing deterioration of a temperature sensor mounted on an insulation circuit board together with a semiconductor element.SOLUTION: A semiconductor device includes: an insulation circuit board 1; a semiconductor element having a first main electrode joined with an upper surface of a first conductor layer of the insulation circuit board 1 through a first joint material, a semiconductor substrate formed on an upper surface of the first main electrode and a second main electrode formed on an upper surface of the semiconductor substrate; and a resistance element 4 having a lower surface electrode 49 joined to an upper surface of a second conductor layer of the insulation circuit board 1 through a second joint material 2b, resistive layers 43a, 43b of which one ends are electrically connected to the lower surface electrode 49 and an upper surface electrode 45a electrically connected to the other ends of the resistive layers 43a, 43b. The first main electrode has a first joint layer jointed to the first joint material, the lower surface electrode 49 has second joint layers 49a, 49b joined with the second joint material 2b, and the first joint layer and the second joint layers 49a, 49b have the same structure.SELECTED DRAWING: Figure 4
Inventors:
OGAWA ERI
Application Number:
JP2020136408A
Publication Date:
February 25, 2022
Filing Date:
August 12, 2020
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L25/07; H01L23/58; H01L25/00
Attorney, Agent or Firm:
Hirose Hajime