Title:
半導体装置
Document Type and Number:
Japanese Patent JP4566794
Kind Code:
B2
Abstract:
To provide an ID chip which can increase the gain of an antenna and can improve the mechanical strength of an integrated circuit, without suppressing the circuit scale.
A semiconductor device represented by the ID chip comprises the integrated circuit using a semiconductor element, consisting of a thin semiconductor film and the antenna connected to the integrated circuit. The antenna and the integrated circuit are formed on one and the same substrate. Conductor lines or conductive films of the antenna are formed in two layers so as to interpose the substrate where the integrated circuit is formed.
COPYRIGHT: (C)2006,JPO&NCIPI
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Inventors:
Shunpei Yamazaki
Mai Akiba
Mai Akiba
Application Number:
JP2005082337A
Publication Date:
October 20, 2010
Filing Date:
March 22, 2005
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/822; H01L23/52; H01L21/3205; H01L21/336; H01L25/00; H01L27/04; H01L27/12; H01L29/786
Domestic Patent References:
| JP2002271127A | ||||
| JP2000311226A | ||||
| JP2000020665A | ||||
| JP11135675A |