Title:
半導体装置
Document Type and Number:
Japanese Patent JP4779614
Kind Code:
B2
Abstract:
A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductorsensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
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Inventors:
Hiroshi Saito
Application Number:
JP2005354458A
Publication Date:
September 28, 2011
Filing Date:
December 08, 2005
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L23/02; G01L9/00; G01L19/14; H01L23/00; H01L23/08
Domestic Patent References:
| JP2003258141A | ||||
| JP2000164747A | ||||
| JP9107054A | ||||
| JP10189792A | ||||
| JP2004260011A | ||||
| JP7273235A | ||||
| JP2002372473A | ||||
| JP2003337073A | ||||
| JP2001176994A | ||||
| JP63284898A |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe