PURPOSE: To improve the reliability of a semiconductor device by securing the durability of a resin used as a reinforcing material at the time of mounting the semiconductor device on a glass substrate.

CONSTITUTION: A flip chip IC 1 is stuck to the upper surface of a glass substrate 2 with solder bumps and the gap between the substrate 2 and IC 1 is fixed with a resin 4. The diameter of silica grains of the filler mixed in the resin 4 is set to that silica grains having a larger diameter can be mixed in the filler and a target value of the linear expansion coefficient of the resin is decided at a ≤35ppm/°C from durability tests, etc. In addition the viscosity of the resin is decided at ≤650 poise. As a result, the most desirable diameter of the silica grains of the filler becomes 3μm and, when the diameter becomes 3μm, the filler content of the resin 4, coefficient of linear expansion of the resin, and viscosity of the resin 4 respectively become 65%, 23ppm/°C, and about 500 poise. Therefore, a resin which can uniformly fill the gap between the IC 1 and substrate 2 with high fluidity without deviation and has high durability can be obtained.