To provide a semiconductor device having high reliability without any reflow crack by using a new bonding tape freed of disadvantages in die bonding material in which cracks are caused in the semiconductor device by vaporization of moisture contained in the die bonding material or a sealing compound and volatilized gases of an adhesive resin and the reliability of the semiconductor device is deteriorated.

This semiconductor device is obtained by bonding a semiconductor element to a supporting member with a thermosetting bonding tape consisting essentially of a resin composition prepared by compounding a solvent- soluble prepolymer, obtained by reacting a maleimide compound having ≥2 maleimide groups in one molecule with an amino compound having ≥2 amino groups in one molecule in an organic solvent and having 20,000-200,000 weight- average molecular weight (component A) with a cross-linking agent reactive with the maleimide groups in the component A or in the prepolymer (component B) and at least one resin selected from the group consisting of an acrylic rubber, an ethylene-acrylic rubber and an acrylonitrile-butadiene rubber (component C).