Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5735356
Kind Code:
A
Abstract:
PURPOSE: To protect against radiation emitted from a semiconductor container and the like by covering the surface of a semiconductor chip by polyimide foil.
CONSTITUTION: The semiconductor chip 1 is set at a specified position of the die- bonded semiconductor container 2. The tape shaped polyimide foil 3 is prepared at the side of said position. The polymide foil tape 3 is cut with a cutter 4, and supplied on a table 5. Polyimide series bonding agent is applied on the back surface of the tape. Said polyimide foil 3 is absorbed by a vacuum chuck 6, and bonded to the desired position of the semiconductor chip 1.
Inventors:
AKATSUKA TSUTOMU
Application Number:
JP11123880A
Publication Date:
February 25, 1982
Filing Date:
August 13, 1980
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/29; H01L23/31; H01L23/556; (IPC1-7): H01L23/30
Domestic Patent References:
| JPS5643614A | 1981-04-22 |