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Patent Searching and Data


Title:
SEMICONDUCTOR ELEMENT AND INSPECTION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2005175004
Kind Code:
A
Abstract:

To suppress that a metal forming an inspection electrode is scraped by sliding of a probe when the probe is brought into contact on the inspection electrode, to suppress a nondelivery phenomenon on the electrode in wiring assembly, and to miniaturize an area of the inspection electrode.

A semiconductor element has the inspection electrode 10 with which the probe 12 inspecting an electric characteristic is brought into contact. In the inspection electrode 10, a slope 10a is installed so that it becomes high in a direction where the probe 12 slides on the inspection electrode 10 from a position where the probe 12 is brought into contact with the inspection electrode 10. Thus, sliding of the probe 12 is limited and the area where the metal of the inspection electrode 10 is scraped can be suppressed. In wiring assembly such as wire bonding in a wiring assembly process, the nondelivery phenomenon due to lack of a bonding area by a scrape of the inspection electrode 10 by the probe 12 is eliminated. The area of the inspection electrode 10 can be miniaturized and the bonding area required in the wiring assembly process can be secured.


Inventors:
NAKAYAMA TOMOYUKI
HARA YASUHIDE
OSAKI HIROTO
Application Number:
JP2003000409175
Publication Date:
June 30, 2005
Filing Date:
December 08, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/66; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; H01L21/66
Attorney, Agent or Firm:
宮井 暎夫
伊藤 誠