SEMICONDUCTOR ELEMENT AND INSPECTION METHOD THEREFOR

Japanese Patent JP2005175004

A

To suppress that a metal forming an inspection electrode is scraped by sliding of a probe when the probe is brought into contact on the inspection electrode, to suppress a nondelivery phenomenon on the electrode in wiring assembly, and to miniaturize an area of the inspection electrode.

A semiconductor element has the inspection electrode 10 with which the probe 12 inspecting an electric characteristic is brought into contact. In the inspection electrode 10, a slope 10a is installed so that it becomes high in a direction where the probe 12 slides on the inspection electrode 10 from a position where the probe 12 is brought into contact with the inspection electrode 10. Thus, sliding of the probe 12 is limited and the area where the metal of the inspection electrode 10 is scraped can be suppressed. In wiring assembly such as wire bonding in a wiring assembly process, the nondelivery phenomenon due to lack of a bonding area by a scrape of the inspection electrode 10 by the probe 12 is eliminated. The area of the inspection electrode 10 can be miniaturized and the bonding area required in the wiring assembly process can be secured.

JPS5563768	THRESHOLD VOLTAGE MEASURING INSTRUMENT
WO/2015/100099	DEFECT DISCOVERY AND INSPECTION SENSITIVITY OPTIMIZATION USING AUTOMATED CLASSIFICATION OF CORRESPONDING ELECTRON BEAM IMAGES
JP3178542	Probe card handling mechanism

NAKAYAMA TOMOYUKI
HARA YASUHIDE
OSAKI HIROTO

JP2003409175A

June 30, 2005

December 08, 2003

Click for automatic bibliography generation  

MATSUSHITA ELECTRIC IND CO LTD

H01L21/66; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; H01L21/66

Akio Miyai
Makoto Ito

Previous Patent: DECOUPLING CAPACITOR AND SEMICONDUCTOR INTEGRATED CIRCUIT

Next Patent: MANUFACTURING METHOD OF SOLAR CELL