To provide a semiconductor package for maintaining good heat radiating characteristic of heat generated from a semiconductor element, a method for manufacturing the same package, and a method for using semiconductor package as the semiconductor package even when warp is generated by brazing a frame to a heat conductive substrate on which a semiconductor element is provided, and as a method for manufacturing the semiconductor package and moreover for use of such semiconductor package.
The semiconductor package 10 is provided with a metal substrate 12 including an upper surface 12a as the flat surface and a lower surface 12b as the projected surface, a semiconductor element 14 mounted in the side of upper surface 12a of this metal substrate 12, and a frame 15 brazed to the upper surface 12a of the metal substrate 12 in such a manner as surrounding the semiconductor element 14 from the outside.
COPYRIGHT: (C)2007,JPO&INPIT
ITO SEIJI
TAKAGI KAZUTAKA
Shunguchi Sekiguchi
Akio Saruwatari
Junichi Furukawa
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