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Title:
SEMICONDUCTOR RESIN-SEALED DEVICE
Document Type and Number:
Japanese Patent JPH01162341
Kind Code:
A
Abstract:

PURPOSE: To dispense with a work for confirming a vacuum gauge during a resin sealing process by a method wherein, after the interior of a metal mold is sealed, the interior is evacuated for a constant time and the degree of vacuum reached at that time is compared with a set degree of vacuum to decide whether there is an abnormality or not.

CONSTITUTION: When a metal mold is brought into a state that the metal mold is clamped, a clamping detector 4 outputs a signal and a solenoid valve 2 is opened by a vacuum control means 52 to start an evacuation in the metal mold. The degree of vacuum in this metal mold is detected by a vacuum gauge 3 and the measured value is inputted in a decision means A53. The means A 53 decides whether the degree of vacuum reached a setpoint within a previously set constant time and in case the degree of vacuum reached the setpoint, a plunger 1b is driven to pour a sealing resin. In case the degree of vacuum does not reach the setpoint, a display signal is outputted to an alarm display A6 and at the same time, a signal for stopping an operation is outputted to the means 52.


Inventors:
YAMAZAKI KATSUHIKO
UENO NOBUTAROU
Application Number:
JP32200187A
Publication Date:
June 26, 1989
Filing Date:
December 18, 1987
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B29C45/02; B29C45/76; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/76; B29L31/34; H01L21/56
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)



 
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