Title:
センサ
Document Type and Number:
Japanese Patent JP7050645
Kind Code:
B2
Abstract:
To increase the assemblability.SOLUTION: In a liquid-state sensor 10, a mold base 32 of an electrode sensor part 30 has an electrode holding mold part 34, and the electrode holding mold part 34 is integrally provided with an outside electrode unit 50 and an inside electrode unit 60. Accordingly, in the electrode sensor part 30, the mold base 32, the outside electrode unit 50, and the inside electrode unit 60 are unified. The mold base 32 has a substrate fixing mold part 36, and a first substrate 80 and a second substrate 90 are fixed to the substrate fixing mold part 36. Accordingly, the electrode sensor part 30 integrally provided with the outside electrode unit 50 and the inside electrode unit 60, the first substrate 80, and the second substrate 90 can be assembled as an electrode substrate assembly 20. This can increase the assemblability of the liquid-state sensor 10.SELECTED DRAWING: Figure 2
Inventors:
Yukinori Kameda
Naohiro Yoshida
Naohiro Yoshida
Application Number:
JP2018199035A
Publication Date:
April 08, 2022
Filing Date:
October 23, 2018
Export Citation:
Assignee:
KYB Corporation
International Classes:
G01N27/22; G01N27/06
Domestic Patent References:
| JP2013195160A | ||||
| JP2006153840A | ||||
| JP2012108030A | ||||
| JP2010536020A | ||||
| JP57048616A |
Foreign References:
| US20110308304 | ||||
| US20150285777 |
Attorney, Agent or Firm:
Kiyoshi Kato