Title:
センサ
Document Type and Number:
Japanese Patent JP7050646
Kind Code:
B2
Abstract:
To increase the assemblability and reduce the cost for manufacturing products with different specifications.SOLUTION: An electrode sensor part 30 of a liquid-state sensor 10 has a mold unit 31, and the mold unit 31 includes a mold base 32 and an outside electrode 52 integrally formed with an electrode holding mold part 34 of the mold base 32. This removes the necessity of building the outside electrode 52 in the mold base 32, the assemblability of the liquid-state sensor 10 can be increased. Also, an inside electrode 66 is fixed to the mold unit 31 and the electrode sensor part 30 is formed. For that reason, electrode sensor parts 30 with different specifications can be formed by fixing the inside electrode 66 having a detection unit 66A with its size changed to the mold unit 31. In other words, the number of types of the metallic mold forming the mold unit 31 can be reduced to one.SELECTED DRAWING: Figure 2
Inventors:
Yukinori Kameda
Naohiro Yoshida
Naohiro Yoshida
Application Number:
JP2018199037A
Publication Date:
April 08, 2022
Filing Date:
October 23, 2018
Export Citation:
Assignee:
KYB Corporation
International Classes:
G01N27/22; G01N27/06
Domestic Patent References:
| JP2009025185A | ||||
| JP2015225047A | ||||
| JP4094560U |
Foreign References:
| US4635473 |
Attorney, Agent or Firm:
Kiyoshi Kato