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Title:
SHEET FOR VACUUM PACKING FOR VACUUM PRESS MOLDING OF PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JPH04319421
Kind Code:
A
Abstract:

PURPOSE: To set efficiently in a short time and use repeatedly by vacuum packing a silicone rubber sheet molded into the shape of covering a body to be molded preliminarily.

CONSTITUTION: A body 3 to be molded is placed on a platen 5 in the printed- wiring board vacuum press molding method, and a sheet 1 for vacuum packing covered and sealed through a non-woven cloth 2 is a silicone rubber sheet 1 solid molded into the shape of a body 3 to be molded perliminarily. Said sheet 1 is kept in the firmly press bonded state on seal components 6 on the peripheral ends of the platen 5, and air is exhausted out of an air outlet 7 on the center of the platen, and the body 3 to be molded is vacuum packed. The shape of the sheet is restored to the original after molding and can be used for molding repeatedly.


Inventors:
ITO SHOJI
OCHIAI NOBUYUKI
TAKEGAWA KANJI
Application Number:
JP11401891A
Publication Date:
November 10, 1992
Filing Date:
April 17, 1991
Export Citation:
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Assignee:
AICA KOGYO CO LTD
International Classes:
B29C51/10; B29C51/28; H05K3/46; B29K83/00; B29L31/34; (IPC1-7): B29C51/10; B29C51/28; B29K83/00; B29L31/34; H05K3/46



 
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