Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3128885
Kind Code:
B2
Inventors:
Takao Arai
Application Number:
JP23423791A
Publication Date:
January 29, 2001
Filing Date:
September 13, 1991
Export Citation:
Assignee:
NEC
International Classes:
H01L27/04; H01L21/822; H01L21/8222; H01L27/06; H01L29/866; (IPC1-7): H01L21/8222; H01L21/822; H01L27/04; H01L27/06; H01L29/866
Domestic Patent References:
| JP4822286A | ||||
| JP4881490A | ||||
| JP58114456A | ||||
| JP5914670A | ||||
| JP60103658A | ||||
| JP4958726A | ||||
| JP5922368A | ||||
| JP59128748U | ||||
| JP62204352U | ||||
| JP4614339Y1 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)