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Title:
SILICON CARBIDE SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2011233636
Kind Code:
A
Abstract:

To provide a silicon carbide substrate capable of preventing a void from forming in the silicon carbide substrate having a plurality of single crystal layers and a manufacturing method of the same.

A carbon layer 31 is formed on a first region of a principal plane of a material substrate 22. First and second single crystal layers 11 and 12 are arranged on the material substrate 22 so that each of a first rear face B1 of the first single crystal layer 11 and a second rear face B2 of the second single crystal layer 12 has a part facing a second region R2 of the principal plane of the material substrate 22, and a gap GP placed between a first side face S1 of the first single crystal layer 11 and a second side face S2 of the second single crystal layer 12 is disposed on the carbon layer 31. By heating the material substrate 22 and the first and second single crystal layers 11 and 12, a base substrate which is jointed to each of the first and second rear faces 11 and 12 is formed.


Inventors:
NISHIGUCHI TARO
HARADA MAKOTO
INOE HIROKI
SASAKI MAKOTO
Application Number:
JP2010101146A
Publication Date:
November 17, 2011
Filing Date:
April 26, 2010
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/02; H01L21/20; H01L21/336; H01L29/12; H01L29/78
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Masato Sasaki