Title:
硬質遮断材料上のシリコンコーティング
Document Type and Number:
Japanese Patent JP7199978
Kind Code:
B2
Abstract:
A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.
Inventors:
Adam Andrew Prois
Richard A. Bradley Jr.
George Jay Oakenfuss
Marcus Katilhi
Andrew Clark
Marius Grigonis
Andy Schkabuko
Nicholas Alexander Davis
Anthony Jay Kemp Cottrell
Richard A. Bradley Jr.
George Jay Oakenfuss
Marcus Katilhi
Andrew Clark
Marius Grigonis
Andy Schkabuko
Nicholas Alexander Davis
Anthony Jay Kemp Cottrell
Application Number:
JP2019007233A
Publication Date:
January 06, 2023
Filing Date:
January 18, 2019
Export Citation:
Assignee:
Viavi Solutions Inc.
International Classes:
C23C14/00
Domestic Patent References:
| JP2002292346A | ||||
| JP2005521868A | ||||
| JP1124863A |
Foreign References:
| US4427516 |
Attorney, Agent or Firm:
Kenji Sugimura
Tetsuo Tsukanaka
Hiromitsu Takashi
Tetsuo Tsukanaka
Hiromitsu Takashi