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Title:
SILICONE RUBBER ADHESIVE COMPOSITION AND INTEGRATED MOLDED ARTICLE OF THE ADHESIVE COMPOSITION WITH THERMOPLASTIC RESIN
Document Type and Number:
Japanese Patent JP2002020719
Kind Code:
A
Abstract:

To provide a silicone rubber adhesive composition which can simply integrally be molded with a thermoplastic resin in a short time by an injection molding method, is suitable for primer-less molding processes, has good adhesivity to the thermoplastic resin, can be adhered to the thermoplastic resin to give the integrally molded article without modifying the thermoplastic resin, and is useful for electric machines, electronic machines, automobiles, precision machines, construction-related articles, and so on.

This silicone rubber adhesive composition characterized by comprising (A) 100 pts.wt. of a thermosetting organopolysiloxane composition, (B) 1 to 100 pts.wt. of reinforcing silica fine powder, (C) 0.1 to 50 pts.wt. of an adhesivity-imparting component, and (D) 0.05 to 20 pts.wt. of a compound having at least one ester group in the molecule.


Inventors:
FUJIKI HIRONAO
AZECHI SHIYUUICHI
Application Number:
JP2000209699A
Publication Date:
January 23, 2002
Filing Date:
July 11, 2000
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08J5/00; C08J5/12; C08K3/36; C08L83/04; C08L83/07; C09J4/00; C09J183/04; C09J183/05; C09J183/07; (IPC1-7): C09J183/04; C08J5/00; C09J4/00; C09J183/05; C09J183/07
Attorney, Agent or Firm:
Takashi Kojima (1 person outside)