Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SILYLATION REAGENT SOLUTION, SURFACE TREATMENT METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017228612
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a silylation reagent solution whose flammability is reduced without impairing water repellency or hydrophobicity ability, and also to provide a surface treatment method using the silylation reagent solution and a method of manufacturing a semiconductor device.SOLUTION: Disclosed is a silylation reagent solution which contains a silylation reagent and a solvent. The solvent is 50°C or more in a flash point and at least one selected from the group consisting of linear or branched carboxylic acid ester, a hydrocarbon solvent and glycol alkyl ether.SELECTED DRAWING: None

Inventors:
MORI DAIJIRO
KUMAZAWA AKIRA
Application Number:
JP2016122762A
Publication Date:
December 28, 2017
Filing Date:
June 21, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
H01L21/304; H01L21/027
Domestic Patent References:
JP2013138178A2013-07-11
JP2008533216A2008-08-21
JPH08337772A1996-12-24
Foreign References:
WO2014034688A12014-03-06
WO2012157635A12012-11-22
US20060228566A12006-10-12
KR20150100412A2015-09-02
Attorney, Agent or Firm:
Masayuki Masabayashi



 
Previous Patent: A manufacturing method of an electron and electric parts, an epoxy resin constituent for injection m...

Next Patent: A cleaning method and a storage of a substrate processing device and a substrate processing device