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Title:
SOFT POLYPROPYLENE-BASED RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005054133
Kind Code:
A
Abstract:

To provide a soft polypropylene-based resin composition excellent in thermal stability.

This soft polypropylene-based resin composition contains (A) a propylene-based block copolymer containing (a) 20-80 mass % eluted component at <20°C, (b) 10-70 mass % eluted component at ≥20°C and <100°C and (c) 1-40 mass % eluted component at ≥100°C [provided that the total of the (a), (b) and (c) is 100 mass %] fractionated by a temperature elevation elution fractionation method using o-dichlorobenzene solvent, wherein a mixed component consisting of the (a) and (b) components in the block copolymer is constituted of a random copolymer containing 10-80 mol % monomer unit based on ethylene and 90-20 mol % monomer unit based on propylene, and (B) a cyclic phosphite compound.


Inventors:
KISHIDA TOYOJI
ENDO MASAHIKO
MUKUI MISAO
Application Number:
JP2003288627A
Publication Date:
March 03, 2005
Filing Date:
August 07, 2003
Export Citation:
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Assignee:
IDEMITSU PETROCHEMICAL CO
International Classes:
C08L53/00; C08K5/524; (IPC1-7): C08L53/00; C08K5/524
Attorney, Agent or Firm:
Tamotsu Otani
Masamichi Tohei