To provide a solder applicator and a solder applying method by which a solder material is applied appropriately on the entire joining face and a high joining strength can be obtained.
This solder applicator 1 for forming a solder layer on the target face of a workpiece is equipped with: a solder melting basin 11 for storing fused solder; a heater 12 for heating the solder in the solder melting basin 11; a vibrating plate 14 which is partly immersed in the fused solder in the solder melting basin 11 and which oppositely faces the target face of the workpiece 21 in the part of the plate immersed in the fused solder; a ultrasonic transducer 16 for vibrating the vibrating plate 14; and a robot hand 17 for relatively moving the vibrating plate 14 and the workpiece 21, wherein the robot hand 17 is intended to repeatedly change the moving direction at least in two directions, in a plane parallel to the plate face immersed in the fused solder of the vibrating plate 14.
| JP3008441 | [Name of invention] Jet solder bath |
| JPS5234364 | PRINTED BOARD AUTOMATIC SOLDERING DEVICE |
| JPH04172174 | METHOD AND DEVICE FOR AUTOMATIC SOLDERING |
Takashi Tomizawa
Ikuo Yamanaka