Title:
SOLDER BALL, ELECTRONIC COMPONENT AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2009072816
Kind Code:
A
Abstract:
To provide a metal-plated solder ball excellent in oxidation resistance, corrosion resistance, storage stability and wettability (soldering property), and to provide an electronic component and a circuit board.
Ni plating, NiB plating, NiP plating, NiBP plating, Co plating, CoB plating, CoP plating or CoBP plating, which is hard to be oxidized is applied to a surface of the solder ball by the electroless plating method or the electric plating method to cover an exposed metal portion of the surface of the solder ball and to prevent rust.
Inventors:
YAMAMOTO YUKIHIRO
TANAKA MASAMOTO
TANAKA MASAMOTO
Application Number:
JP2007244757A
Publication Date:
April 09, 2009
Filing Date:
September 21, 2007
Export Citation:
Assignee:
NIPPON STEEL MATERIALS CO LTD
International Classes:
B23K35/26; B23K35/14; C22C13/00; H01L21/60; H05K3/34
Attorney, Agent or Firm:
Mamoru Ushiki
Masayoshi Yoshida
Hiromitsu Imaeda
Umemura Hiroaki
Masayoshi Yoshida
Hiromitsu Imaeda
Umemura Hiroaki