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Patent Searching and Data


Title:
SOLDER BALL PRINTING DEVICE AND SOLDER BALL PRINTING METHOD
Document Type and Number:
Japanese Patent JPH08300613
Kind Code:
A
Abstract:

PURPOSE: To enable the supply of solder balls to arbitrary positions on a printed board by a method wherein a metal mask having a solder ball printing part, in which solder balls are housed, and squeegees, which slide on the metal mask, are provided.

CONSTITUTION: This solder ball printing device 1 mainly consists of a metal mask 10, a first and a second squeegees 20 and 30, a bed, a driving means for driving the first and the second squeegees 20 and 30 and the like. At the center of the metal mask 10, a solder ball printing part 11a is made by projecting strips 11. Further, at both the sides of the solder ball printing part 11a, a first and a second solder ball storing parts 11b and 11c are made of the same projecting strips 11 as just mentioned above. Furthermore, by means of a printing method, in which the metal mask and the squeegees are used, solder balls are easily supplied to arbitrary positions on a printed board, resulting in allowing to automatize the forming operation of ball grid array terminals.


Inventors:
MAGARIYA MITSUMASA
Application Number:
JP13877195A
Publication Date:
November 19, 1996
Filing Date:
May 12, 1995
Export Citation:
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Assignee:
NEC CORP
International Classes:
B41F15/08; B23K3/06; B41F15/40; H01L21/60; H05K3/24; H05K3/34; (IPC1-7): B41F15/08; B23K3/06; B41F15/40; H05K3/24; H05K3/34
Domestic Patent References:
JPH02244696A1990-09-28
JPH03257989A1991-11-18
Attorney, Agent or Firm:
Kihei Watanabe