Solder removal system - Hakuko Co., Ltd.

Title:

Solder removal system

Document Type and Number:

Japanese Patent JP6100347

Kind Code:

B2

Inventors:

Toshikazu Mochizuki
Hitoshi Takeuchi
Tetsuo Yokoyama

Application Number:

JP2015225105A

Publication Date:

March 22, 2017

Filing Date:

November 17, 2015

Export Citation:

Assignee:

Hakuko Co., Ltd.

International Classes:

B23K1/018; B23K1/00

Domestic Patent References:

Attorney, Agent or Firm:

Etsushi Kotani
Masataka Otani
Tamagushi Yukihisa

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