Title:
SOLDER SUCTION DEVICE
Document Type and Number:
Japanese Patent JPH1157992
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a solder suction device of high reliability. SOLUTION: The solder suction device is arranged with a main body 2 of the solder suction device moving in proximity to a pad 9 used for soldering an electronic part, a blowing nozzle 3, which is arranged to a lower part tip of the main body 2 and blows a hot wind A from above to down, a suction nozzle 4, which is arranged to a lower part tip of the main body 2 parallel to the blowing nozzle and melts/sucks a residual solder 8 stuck on the pad 9 together with the hot wind A, and a guide roller 1, on which the main body 2 is loaded and which moves along the pad 9. By this method, operation safety of the solder suction device is improved.
Inventors:
IZAWA ISAO
Application Number:
JP22229097A
Publication Date:
March 02, 1999
Filing Date:
August 19, 1997
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B23K1/018; B23K3/02; H05K3/34; (IPC1-7): B23K1/018; B23K3/02; H05K3/34
Attorney, Agent or Firm:
Norio Ogo (1 outside)