To provide a solder wettability testing device and a solder wettability testing method capable of offering an accurate wet curve stably for any type of component to be mounted.
The solder wettability testing device 1 measures the wettability of solder when a component 2 to be mounted on a base board 3 is soldered. The device 1 is equipped with: a placing table 5 whereon the base board 3 with the component 2 mounted is placed through a cream solder S; a heating means 6 to heat the cream solder S; a displacement measuring means 8 to measure the displacement of the solder fed to the join 3a of the component 2 with a land 12; and a processing means 10 to prepare a solder wet curve expressed as a change with time of the displacement in accordance with the measuring result of the displacement measuring means 8.
Eiichi Tamura
Seiji Iga
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