Title:
音波センサの製造方法
Document Type and Number:
Japanese Patent JP7283695
Kind Code:
B2
Abstract:
To provide a manufacturing method of a small sound wave sensor capable of securely bonding at a position separated from a detection object by a predetermined dimension and obtaining a desired detection signal.SOLUTION: By forming a plurality of sound wave sensors on an aggregate substrate 1 and then dividing them into individual pieces, a small sound wave sensor including adhesive members 4, 4a can be simultaneously formed. The adhesive members 4, 4a can be formed as an aggregate of sheet-like adhesive members 4, 4a and can be cut in a step for dividing into the individual pieces.SELECTED DRAWING: Figure 1
Inventors:
Hiroyuki Kuchichi
Naomi Masumoto
Naomi Masumoto
Application Number:
JP2019130025A
Publication Date:
May 30, 2023
Filing Date:
July 12, 2019
Export Citation:
Assignee:
Nisshinbo Microdevices Inc.
International Classes:
G01N29/12; G01N29/24; H04R31/00
Domestic Patent References:
| JP2011014652A | ||||
| JP2013093637A | ||||
| JP2010040655A | ||||
| JP2009044600A | ||||
| JP2018032896A | ||||
| JP2004037287A | ||||
| JP2020134229A | ||||
| JP2008005464A | ||||
| JP2002345062A |
Foreign References:
| WO2015111581A1 | ||||
| US20160311679 |
Attorney, Agent or Firm:
Osamu Hasegawa