Title:
分割スパッタリングターゲット
Document Type and Number:
Japanese Patent JP6960989
Kind Code:
B2
Abstract:
The segmented sputtering target (1) related to one aspect of an embodiment is formed by bonding multiple target materials (10) to a substrate (20), wherein flat surfaces (12) are formed on each of at least some of the side faces (11) of a pair of target materials (10) disposed in at least some of the partitions (40) formed by disposing the multiple target materials (10) with spaces therebetween. Regarding the spacing between the flat surfaces (12) that face each other in a partition (40), the spacing (Lt) of the portion farthest from the substrate (20) is larger than the spacing (Lb) of the portion closest to the substrate (20), and the surface roughness Ra of the flat surfaces (12) is 0.3 µm or less.
More Like This:
Inventors:
Masahiro Miwa
Hiroe Sasaki
Hayashi Shunba
Kure Nobuteru
Hiroe Sasaki
Hayashi Shunba
Kure Nobuteru
Application Number:
JP2019508538A
Publication Date:
November 05, 2021
Filing Date:
October 27, 2017
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C23C14/34
Domestic Patent References:
| JP8144052A | ||||
| JP2016148093A | ||||
| JP2000345326A |
Foreign References:
| WO2012144107A1 | ||||
| WO2016002633A1 |
Attorney, Agent or Firm:
Sakai International Patent Office