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Title:
SPUN-BONDED NON-WOVEN FABRIC AND DIAPER USING THE SAME
Document Type and Number:
Japanese Patent JP2000192361
Kind Code:
A
Abstract:

To provide a spun-bonded non-woven fabric capable of lowering a sealing temperature on the production of a diaper, consequently capable of maintaining the excellent flexibility and touch of sealed portions, and excellent in strength and continuous productivity, and to provide the diaper comprising the spun-bonded non-woven fabric.

This spun-bonded non-woven fabric comprises a resin material containing at least one of propylene-α-olefin random copolymers and satisfying the following conditions (A) to (D). (A) The content of the propylene-α-olefin random copolymer is 2-10 mol.%. (B) The melting peak temperature is ≤150°C. (C) The melt index (230°C, 2.16 kg) is 10-100 g/10 min. (D) The mol. wt. distribution (Mw/Mn) is 2.0-6.0. A diaper uses the spun-bonded non-woven fabric.


Inventors:
NAKAGAMI HIROYUKI
MITSUZUKA HIROYUKI
Application Number:
JP36474898A
Publication Date:
July 11, 2000
Filing Date:
December 22, 1998
Export Citation:
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Assignee:
IDEMITSU PETROCHEMICAL CO
International Classes:
A61F13/15; A61F13/00; A61F13/49; D04H3/007; D04H3/16; (IPC1-7): D04H3/16; A61F13/00; D04H3/00
Attorney, Agent or Firm:
Tohei Masamichi