Title:
SPUTTERING TARGET FOR FORMING WIRING AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH06336673
Kind Code:
A
Abstract:
PURPOSE: To provide an Al alloy target contg. uniformly distributed group IVa or Va metallic elements.
CONSTITUTION: This sputtering target for forming a wiring is made of a refined material consisting of 0.2-2.0wt.% one or more kinds of group IVa or Va metallic elements other than Ti, 0.2-40wt.% Ti and the balance essentially Al. The amt. of Ti is ≥30wt.% of the total amt. of the group IVa or Va metallic elements. This target is produced by casting a molten alloy having the compsn. into an ingot by bottom pouring and using this ingot as stock.
Inventors:
KAZUYASU MUTSUO
OIKAWA SABURO
KONISHI NOBUTAKE
OIKAWA SABURO
KONISHI NOBUTAKE
Application Number:
JP12652193A
Publication Date:
December 06, 1994
Filing Date:
May 28, 1993
Export Citation:
Assignee:
HITACHI METALS LTD
YASUGI SEIMITSU KK
HITACHI LTD
YASUGI SEIMITSU KK
HITACHI LTD
International Classes:
C22C21/00; C23C14/34; (IPC1-7): C23C14/34; C22C21/00
Attorney, Agent or Firm:
Oba Mitsuru
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