Title:
STRESS RELAXATION AGENT FOR CURABLE RESIN, CURABLE RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2015218317
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a stress relaxation agent for curable resins which has excellent thermal decomposition resistance and improves the stress relaxation performance of a resin composition and a molding when blended with a resin, a curable resin composition containing the stress relaxation agent and a molding of the curable resin composition.SOLUTION: A stress relaxation agent for curable resins consists of a graft copolymer (G) which is formed by grafting a polymer (A) containing a polyorganosiloxane (A1) and/or a poly(meth)acrylic acid alkyl ester (A2) with a vinyl polymer (B), and the vinyl polymer (B) contains a (meth)acrylate ester monomer (b1) unit and an aromatic vinyl monomer (b2) unit.
Inventors:
OIDA NORIKO
WAKITA AYAKA
NODONO MITSUFUMI
WAKITA AYAKA
NODONO MITSUFUMI
Application Number:
JP2014104852A
Publication Date:
December 07, 2015
Filing Date:
May 21, 2014
Export Citation:
Assignee:
MITSUBISHI RAYON CO
International Classes:
C08F283/12; C08F265/06; C08F291/06; C08L51/00; C08L101/00; C09J151/00; C09J183/10; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
| JP2010090371A | 2010-04-22 | |||
| JP2003055533A | 2003-02-26 | |||
| JPH0977844A | 1997-03-25 |
Foreign References:
| WO2009096374A1 | 2009-08-06 | |||
| WO2009034966A1 | 2009-03-19 |