Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3216314
Kind Code:
B2
Abstract:
PURPOSE: To provide a semiconductor device with which a semiconductor chip can be fixed to a substrate with sufficient adhesive strength, and also generating no change in semiconductor chip characteristics when the semiconductor chip is fixed.
CONSTITUTION: The fixing of a semiconductor chip 10 and a plastic molded substrate 6, and fixing of a plastic molded substrate 8 and a transparent plastic lid 18 are conducted using hydroscopic hardening type bonding agents 12 and 20. As a result, sufficient adhesive strength can be obtained. Also, as the above- mentioned bonding agents have a hydroscopic property, the semiconductor chip 10 arranged in a hollow part can be airtightly maintained. Accordingly, generation of discoloration of a color filter caused by the irradiation with strong ultraviolet rays and a visible light, the potential shift by charge-up, and besides fluctuation in characteristics by local heating can be eliminated.
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Inventors:
Hideo Yamanaka
Application Number:
JP7463593A
Publication Date:
October 09, 2001
Filing Date:
March 31, 1993
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/10; H01L27/14; (IPC1-7): H01L23/10; H01L27/14
Domestic Patent References:
| JP485859A | ||||
| JP63248821A | ||||
| JP1161736A |
Attorney, Agent or Firm:
Hidemori Matsukuma
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