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Title:
STRUCTURE OF LASER DIODE SUBMOUNT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2002261371
Kind Code:
A
Abstract:

To obtain an inexpensive laser diode submount causing no deterioration of emission characteristics.

An adhesive material is attached onto a substrate having a metallization face in the vicinity of the metallization face, a solder piece is placed on the upper surface of the metallization face such that one end of the solder piece is mounted on the upper surface of the adhesive material and then bonded by the adhesive material, a jig for positioning an LD element is set on the metallization face and then the LD element is mounted on the metallization face while being guided by the jig and heated thus bonding the LD element to the metallization face of the substrate.


Inventors:
FUJISAWA KAZUMASA
IWASAKI NAOICHI
KOBAYASHI KAZUHIRO
FUKAZAWA KAZUMASA
Application Number:
JP2001059344A
Publication Date:
September 13, 2002
Filing Date:
March 02, 2001
Export Citation:
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Assignee:
CIMEO PREC CO LTD
CITIZEN ELECTRONICS
International Classes:
H01S5/022; (IPC1-7): H01S5/022
Domestic Patent References:
JP2000040834A2000-02-08
JPH09216088A1997-08-19
JPH0399492A1991-04-24
JPS60201619A1985-10-12
JPH11233930A1999-08-27
JP2000040834A2000-02-08
JPH09216088A1997-08-19
JPH0399492A1991-04-24
JPS60201619A1985-10-12
JPH11233930A1999-08-27
Attorney, Agent or Firm:
Takamune Hiroaki



 
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