Title:
STRUCTURE OF SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3519924
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To surely reduce occurrence of strains and cracks in an IC chip, by bonding the IC chip to the surface of the substrate of a polyimide film by putting electrode pad portions upon another, so that the portions may be compressively deformed with an adhesive film containing conductive particles.
SOLUTION: After an IC chip 3 is put on the surface of a polyimide film 1 with the electrodes 4 of the chip 3 facing downward and an adhesive film 2 in between, the film 1 and the chip 3 are pressed against each other so as to compress the adhesive film 2 held between the film 1 and the chip 3. While the pressing state is maintained, the adhesive film 2 is dried and hardened by heating, etc. Therefore, the film 1 and the chip 3 can be firmly bonded to each other with the adhesive film 2. In addition, the solder bumps 9 on the polyimide film 1 can be surely electrically connected to the electrode pads 4 of the IC chip 3.
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Inventors:
Miyata, Osamu
Shibata, Kazutaka
Shibata, Kazutaka
Application Number:
JP32130397A
Publication Date:
April 19, 2004
Filing Date:
November 21, 1997
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L21/60; H01L21/00; H01L21/50; H01L23/00; H01L23/12; H01L23/28; H01L23/50; (IPC1-7): H01L21/60; H01L23/12
Attorney, Agent or Firm:
石井 暁夫 （外２名）