To provide a wafer separating method and a wafer separating apparatus, which can separate a very thin wafer in a safe, simple, reliable and rapid manner.
The wafer separating method includes separating the uppermost layer wafer from a wafer laminate comprising a number of or a plurality of wafers stacked on top of each other and immersed in a liquid. The wafer separating method includes: a step of holding the uppermost layer wafer in an axial direction which is deviated by an angle of 15 to 75 clockwise or anticlockwise from a crystal habit line axis of the uppermost layer wafer; a step of, while warping the peripheral part of the uppermost layer wafer upward so as to cause bending stress of the uppermost layer wafer in the axial direction, blowing a liquid into between the lower surface of the uppermost layer wafer and the upper surface of a wafer located on and adjacent to the lower side of the uppermost layer wafer; and a step of lifting the uppermost layer wafer to separate the wafer.
MASHITA IKUO
SAITO KOICHI
