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Title:
SUBSTRATE BONDING METHOD AND INKJET HEAD, AND IMAGE FORMING APPARATUS
Document Type and Number:
Japanese Patent JP2010184434
Kind Code:
A
Abstract:

To prevent an adhesive from being swollen out to a flow path thereof upon bonding and, at the same time, to obtain a large adhesive strength.

A substrate bonding method for bonding at least two sheets of substrates each having an opening part with the adhesive comprises: a step of applying a high-viscosity adhesive onto a surface of one substrate having the opening part, the surface being a bonding surface around the opening part of the one substrate, thereby forming protrusion parts around the opening part and applying a low-viscosity adhesive onto the surface of the substrate of a part other than the protrusion parts in such a manner that the height of the applied low-viscosity adhesive from the surface of the substrate becomes lower than the height of the protrusion part; and a step of adhering, to the one substrate on which the high-viscosity adhesive and the low-viscosity adhesive have been applied, the other substrate in such a manner that the other substrate first comes in contact with the protrusion parts formed by the high-viscosity adhesive and then the other substrate comes in contact with the low-viscosity adhesive.


Inventors:
YOKOUCHI TSUTOMU
Application Number:
JP2009030171A
Publication Date:
August 26, 2010
Filing Date:
February 12, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
B41J2/16; B41J2/045; B41J2/055
Attorney, Agent or Firm:
Kenzo Matsuura