To prevent the cracks in a dielectric layer and deformation of a barrier rib and to reduce cost with improved yield by forming the dielectric layers for covering plural electrodes, and barrier ribs arranged between the respective electrodes for partitioning the adjacent electrodes from one another into band-like forms in parallel with one another, and by composing them with members vitrified by the same heating and baking process.
Since this substrate has a structure wherein electrode covering dielectric layers 3 of data electrodes 2 arranged at a predetermined interval on the surface of a back substrate 1 opposite to a front substrate are separated from barrier ribs 4 for partitioning the adjacent electrodes 2 from one another at their center, stresses generated by constriction differences at a simultaneous heating and baking time do not affect one another. Therefore, defects are reduced, and the number of processes and power consumption are reduced. Each of the dielectric layers may be formed with the electrode covering dielectric layer 3 having a large thickness and a second dielectric layer having a small thickness for connecting it to the barrier ribs 4, and even if a crack is produced at simultaneous heating and baking, it concentrates on a thin contact part or the like. It is recommended that the dielectric layers are formed by a recessed plate transfer method by the use of a molding die having first and second recessed slots corresponding to the electrode covering dielectric layers 3 and the barrier ribs 4.
BETSUI KEIICHI
TOKAI AKIRA
