SUBSTRATE FOR ELECTRIC INSULATION, PREPREG AND PRINTED CIRCUIT BOARD

Japanese Patent JP3833406

B2

PROBLEM TO BE SOLVED: To obtain a substrate for electric insulation, having an insulation layer with the pyrolysis temperature hardly decreased when the insulation layer is composed by impregnating a thermoset resin and hardening the impregnated thermoset resin.
SOLUTION: This material for electric insulation obtained by subjecting a nonwoven fabric in which fibers are mutually bonded with a resin binder, to pressurizing and heating treatment, is characterized by the resin binder containing an epoxy resin using an isocyanate-based resin as a hardener. Preferably, the ratio of the weight of the blended epoxy resin and the isocyanate-based resin in the resin binder is regulated so as to satisfy the equation of [epoxy resin/isocyanate-based resin]=(10/0.5)-(10/51). The nonwoven fabric used for a substrate for the electric insulation is preferably the one obtained by carrying out paper-making by using a para-based aromatic polyamide resin as a main fiber. The fibers are mutually bonded with the resin binder.

Shimazu Tohru
Koichi Hiraoka
Masayuki Noda
Yuhisa Kato
Hiroyoshi Ueno
Ichioka Yuu
Takeichi Adachi
Murata Mamoru

JP24399A

October 11, 2006

January 05, 1999

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Shin-Kobe Electric Machinery Co., Ltd.
Oji Paper Co.,Ltd.

C08G18/58; D21H13/26; D04H1/587; D21H17/52; H05K1/03; (IPC1-7): D04H1/58; C08G18/58

JP200064167A
JP11189963A
JP1088453A
JP10251421A
JP11209456A
JP3221537A
JP247392A

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