SUBSTRATE HOLDER FOR POLISHING DEVICE, AND POLISHING METHOD THEREOF

Title:

SUBSTRATE HOLDER FOR POLISHING DEVICE, AND POLISHING METHOD THEREOF

Document Type and Number:

Japanese Patent JPH08229809

Kind Code:

A

Abstract:

PURPOSE: To provide a substrate holder structure for a polishing device, and a polishing method thereof for forming a flat substrate surface.

CONSTITUTION: A suction hole 5 for carrying a sample to a porous resin layer 4 on the surface of a holder 3 of a substrate 1 and for fixing the sample to the holder 3, and a back pressure hole 6 for improving uniformity of polishing are provided separately. Suction pressure and back pressure at the time of polishing can thus be separately adjusted, thereby polishing work can be performed in the condition where a substrate surface is kept flat.

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Inventors:

KUSUKAWA KIKUO
HONMA YOSHIO
NAGASAWA MASAYUKI
MORIYAMA SHIGEO

Application Number:

JP4157895A

Publication Date:

September 10, 1996

Filing Date:

March 01, 1995

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

B24B37/04; B24B37/30; H01L21/304; H01L21/68; H01L21/683; (IPC1-7): B24B37/04; H01L21/304; H01L21/68

Attorney, Agent or Firm:

Ogawa Katsuo

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