PURPOSE: To separate a wafer safely and in a short time from the surface of a wafer holding member by suitably ejecting a jet stream from a nozzle onto the outer peripheral part of the wafer.
CONSTITUTION: A wafer 20 is mirror-polished such that the wafer 20 is carried on a wafer holding part having a holding member 10 holding the wafer 20 on its surface by surface tension and a template 16 mounted on the holding member 10 and preventing the wafer 20 from sliding and that the surface of the wafer 20 is put into contact with a polishing surface of a surface plate and the wafer 20 is moved relatively to the surface plate while giving a predetermined load to the wafer 20. A nozzle 22 jetting liquid is disposed in the outer peripheral part of the wafer 20 and a cutaway 18 passing the jet stream from the nozzle 22 is disposed in the template 16.
ONISHI SUSUMU
YAMAZAKI TEIICHI
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