Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7116550
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a substrate holding portion which holds a substrate W. The substrate holding portion includes two movable holding pins and two fixed holding pins which sandwich the substrate. The substrate processing apparatus includes two support pins which support the substrate W held by the substrate holding portion from below. Each of the support pins has an inner portion which overlaps the substrate held by the substrate holding portion in a vertical direction. An upper end of the support pin is on a side below an overlapping portion of the substrate which overlaps the inner portion in the vertical direction.
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Inventors:
Takayuki Nishida
Nobuaki Okita
Nobuaki Okita
Application Number:
JP2018021265A
Publication Date:
August 10, 2022
Filing Date:
February 08, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2014022419A | ||||
| JP2017098330A | ||||
| JP2010093189A | ||||
| JP2016189452A | ||||
| JP2017183310A | ||||
| JP2004048035A | ||||
| JP2015002328A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita