Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2022176640
Kind Code:
A
Abstract:
To provide a technology that can control the collapse of 3-D structures.SOLUTION: A substrate processing method includes a phosphoric acid processing process S13, a rough rinse processing process S15, and a single substrate drying process S23. In the phosphoric acid processing process S13, a plurality of substrates are immersed in phosphoric acid in a processing tank. In the rough rinse processing process S15, after the phosphoric acid processing process S13, a portion of the phosphoric acid on the plurality of substrates is replaced with a first rinse solution to the extent that phosphoric acid remains in the pattern of the plurality of substrates. In the single substrate drying process S23, after the rough rinse processing process S15, the plurality of substrates are dried one by one.SELECTED DRAWING: Figure 5
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Inventors:
MAGARA KEIJI
Application Number:
JP2021083171A
Publication Date:
November 30, 2022
Filing Date:
May 17, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/304
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita