Title:
基板加工方法、基板加工装置および基板搬送機構、基板分離装置
Document Type and Number:
Japanese Patent JP4739024
Kind Code:
B2
Abstract:
[Object] A method for processing a substrate and an apparatus for processing a substrate are provided, where a substrate can be prevented from being damaged during conveyance of the substrate, including turning over of the substrate, and the apparatus for processing a substrate having this mechanism for conveying a substrate is miniaturized, so that the area for installment can be reduced. [Means for Achieving Object] An apparatus for processing a substrate which divides a mother substrate into unit substrates is provided with a scribing portion 3 for drawing a scribe line on a mother substrate, a breaking portion 4 for breaking a mother substrate along the formed scribe line, and a portion for conveying a substrate 2 for conveying a mother substrate or a unit substrate at least between the above described respective portions, wherein portion for conveying a substrate 2 has a number of rotational supports 51 and 73 with a suction surface for sucking and holding each substrate from a main surface, rotational supports 51 and 73 have rotational axes 52 and 72, respectively, as well as means for respectively sucking and rotating a substrate which rotates substrates around rotational axes 52 and 72, approximately simultaneously in a state where the substrates are sucked and held in such a manner that at least two main surfaces of each substrate are turned over in the upward and downward direction.
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Inventors:
Okajima Yasutomo
Katsuki Nakata
Katsuki Nakata
Application Number:
JP2005515994A
Publication Date:
August 03, 2011
Filing Date:
December 03, 2004
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; B65G49/06; B65H15/00; C03B33/027; C03B33/03; C03B33/033; C03B33/07; H01L21/677
Domestic Patent References:
| JPH11116260A | 1999-04-27 |
Attorney, Agent or Firm:
Yoshio Kashima