Title:
基板処理方法および基板処理装置
Document Type and Number:
Japanese Patent JP6672091
Kind Code:
B2
Abstract:
A filler solution is supplied to an upper surface of a substrate, forming a coating that is a film of the filler solution. Clearance in the structure on the upper surface of the substrate is filled with the filler solution. Then, a stripping solution is applied to a peripheral region of the upper surface of the substrate, to strip off a portion of the coating formed on the peripheral region. Also, a gas is injected toward a boundary portion between the peripheral region and an inner region of the upper surface of the substrate, to accelerate solidification of an outer edge portion of the coating formed on the inner region, to suppress the spread of the coating from the inner region to the peripheral region. A substrate holder/rotator, fluid supplies, and a gas injection part are provided to carry out the above process.
Inventors:
Nakai Hitoshi
Application Number:
JP2016125628A
Publication Date:
March 25, 2020
Filing Date:
June 24, 2016
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; B05D1/40; B05D3/04; B05D3/10; B05D3/12; H01L21/304; H01L21/306
Domestic Patent References:
| JP201523172A | ||||
| JP2014123704A | ||||
| JP201636012A | ||||
| JP201546449A | ||||
| JP201565396A | ||||
| JP201550414A | ||||
| JP2012186304A |
Attorney, Agent or Firm:
Masahiro Matsusaka
Tsutomu Tanaka
Masamichi Ida
Tsutomu Tanaka
Masamichi Ida