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Patent Searching and Data


Title:
SUBSTRATE SURFACE TREATMENT METHOD
Document Type and Number:
Japanese Patent JPH11289148
Kind Code:
A
Abstract:

To easily take out a surface-treated substrate, regardless of the size of the substrate which can be positioned easily.

In this method, an elastic substrate 2 is placed on a table 1, the substrate 2 is surface-treated, and then the substrate 2 is taken out from the table 1. The surface of the table 1 has an arc-shaped recessed shape. For surface treatment, the substrate 2 is deflected into an arc shape along the arc- shaped recessed surface 11 of the table 1. Then, the substrate 2 is surface- treated. Subsequently, the substrate 2 is formed almost rectilinear by coursing the deflection to be eliminated. Then, the side face 21 of the substrate 2 is held by a chuck, and the substrate is taken out from the table 1.


Inventors:
DEMURA AKIHIRO
YAMADA KOJI
Application Number:
JP10705698A
Publication Date:
October 19, 1999
Filing Date:
April 02, 1998
Export Citation:
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Assignee:
IBIDEN CO LTD
International Classes:
B41F15/08; B23K26/00; B41F15/26; H05K3/00; H05K3/28; (IPC1-7): H05K3/00; B23K26/00; B41F15/08; B41F15/26; H05K3/28
Attorney, Agent or Firm:
Yoshiyasu Takahashi