To provide a substrate treating device which can satisfactorily attract a substrate to its substrate placing part and, at the same time, from which the substrate attracted to the substrate placing section can be removed satisfactorily even when the size of the substrate is increased.
A plurality of adsorption grooves 75 formed on the holding surface of the substrate treating device in a grid-like state are connected to each other at grid points 76. A part of the grid points 76 communicates with suction holes 72. The suction holes 72 are connected to a vacuum pump in communicating states through piping. End-section lifter pins 71a and central-part lifter pins 71b are independently provided in vertically movable states. Consequently, (1) the substrate treating device can attract the whole bottom surface of an angular substrate W even when the device does not have many attraction holes in the holding surface and (2) can attract the angular substrate W to the holding surface from the vicinity of the central part of the substrate W to the end section of the substrate W.
MIZUNO HIROKI
Yoshitake Hidetoshi
Takahiro Arita