Title:
SUBSTRATE TREATING DEVICE
Document Type and Number:
Japanese Patent JP3808649
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simplify the structure of a substrate treating device capable of cleaning a nozzle for discharging a processing soln. and to reduce the device cost.
SOLUTION: The device is used for coating a substrate with a liq. resist and provided with a nozzle 7, a pot 31 and an automatic stop valve 45a. The liq. resist is discharged from the discharge port 20a of the nozzle 7. The pot 31 has an opening 50 and stores a rinsing liq. The rinsing liquid is used to clean the nozzle and to suppress the drying of the nozzle, and the same solvent as that of the liq. resist is used. The liq. level in the pot 31 is changed between a first liq. level H1 and a second liq. level H2 under the control of the automatic stop valve 45a. The rinse is in contact with the discharge port 20a at the first liq. level H1 and not in contact with the discharge port 20a at the second liq. level H2.
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Inventors:
Takayuki Sato
Application Number:
JP35097198A
Publication Date:
August 16, 2006
Filing Date:
December 10, 1998
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B05B15/02; B05C5/02; H01L21/304; (IPC1-7): B05C5/02; B05B15/02; H01L21/304
Domestic Patent References:
| JP5166714A | ||||
| JP9327644A | ||||
| JP6318543A | ||||
| JP64008621A | ||||
| JP1065688U |
Attorney, Agent or Firm:
Yukio Ono
Yoshio Miyagawa
Yoshio Miyagawa