PURPOSE: To facilitate the mount onto a printed circuit board and to prevent any characteristic change in the case of mounting by adding a metallic lead capable of elastic deformation for being soldered to the printed circuit board to each of an exposed end of lead electrodes for external connection respectively.
CONSTITUTION: An input IDT 26 and an output IDT 28 are formed on a chip 22 and two signal lead electrodes 30 for external connection of the IDT 28 and two signal lead electrodes 30a for external connection of the IDT 28 are formed to be prolonged up to the edge of the chip 22. A caption 30b is a ground lead electrode. Then a face of a cap 24 applied with a seal agent 34 is opposite to a face of the chip 22 with an IDT or the like formed thereto so as to expose the edge and overlapped, the seal agent 34 is molten by heating to seal the cap 24 onto the chip 22. Moreover, one end of a metallic lead 32 capable of elastic deformation is fixed to the exposed end of the lead electrode 30 (signal lead electrode 30a and ground lead electrode 30b) with welding or bonding so as to along with the ridge of the chip 22.
| JP5122602 | High frequency switch module |
| JP3683737 | SURFACE ACOUSTIC WAVE DEVICE |
GOUNJI TAKU
TANI ATSUSHI
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