To perform stable surface grinding without lowering of sharpness even if machining is not suspended to perform dressing in surface grinding of various hard and fragile material using a fixed abrasive grain type diamond lapping machine.

Surface grinding is performed while slurry, the abrasive grain of which is 5 to 50% at the volume ratio of abrasive grain to liquid, is supplied. Two or more slurry supply holes 3 are provided on the entire machining surface of the lapping machine uniformly as much as possible, whereby the slurry can be supplied in the same volume per unit hour from the slurry supply holes. The diamond lapping machine 1 is formed of copper-tin-graphite metal bond, the composition of which is 33 to 75 wt.% copper, 18 to 55 wt.% tin, and 2 to 20 wt.% graphite.