表面改質コランダム及び樹脂組成物

Japanese Patent JP5105740

B2

Corundum coated with a silicone compound containing a silicone resin, a resin composition containing the corundum, and an electronic device using an electronic part or semiconductor element, which transmits heat through the resin composition, by which a good affinity between a resin and corundum is obtained and a kneaded product assured of a low viscosity, a uniform dispersibility and when a curable resin is used as the matrix resin, a high curing rate, is yielded so that the handling and moldability of the resin composition can be enhanced.

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Ken Obama
Katsutoshi Kishi

JP2005351251A

December 26, 2012

December 05, 2005

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SHOWA DENKO K.K.

C09C3/12; C08K9/04; C08L101/00; C09C1/40; H01L23/36; H01L23/373

JP2003201116A

US6265126

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama

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