To constitute an inexpensive surface mounting crystal oscillator by laminating and bonding a package (crystal resonator) into which a crystal piece is hermetically enclosed to an IC mounting substrate without using a package with an H-type cross section formed by burning and laminating an expensive ceramic plate.
In the surface mounting crystal oscillator, an IC mounting substrate 7 to which an IC chip 4 is bonded and a crystal resonator 2 composed of a hermetically enclosed crystal piece 3 and crystal packages 2a, 2b are laminated and bonded each other, and a crystal resonator connection terminal 9a of the IC mounting substrate 7 and a terminal 9b of the crystal resonator are mutually connected by a conductor 6a, e.g. a coreless solder ball or an anisotropic conductive sheet.
Takashi Tanabe
Masakage Amano
Yoji Onodera