Title:
Surface-treated copper foil for printed wiring boards, copper-clad laminates for printed wiring boards, and printed wiring boards
Document Type and Number:
Japanese Patent JP6294862
Kind Code:
B2
Abstract:
A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 μm or more but less than 0.5 μm, the BET surface area ratio of the of the silane-coupling-agent-layer surface is 1.2 or higher, and the micro-surface coefficient Cms of the silane-coupling-agent-layer surface is 2.0 or higher but less than 8.0.
Inventors:
Takahiro Saito
Ken Minori
Ken Minori
Application Number:
JP2015240007A
Publication Date:
March 14, 2018
Filing Date:
December 09, 2015
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D7/06; B32B15/04; B32B15/08; C25D5/16; C25D5/48; H05K1/03; H05K1/09
Domestic Patent References:
| JP2015061757A | ||||
| JP2015061939A | ||||
| JP2015105421A |
Foreign References:
| WO2015087941A1 | ||||
| WO2015016271A1 |
Attorney, Agent or Firm:
Toshizo Iida
Shuichi Akabane
Shuichi Akabane